Semiconductor Advanced Packaging

Cheaper in another edition — £87.50 at Springer Nature Link Shop Semiconductor Advanced Packaging · See that edition →

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

The cheapest new copy of Semiconductor Advanced Packaging is £139.99 at Springer Nature Link Shop. Prices checked 12 Nov 2026

Other editions

More by John H. Lau

More by John H. Lau